JPH0575180B2 - - Google Patents
Info
- Publication number
- JPH0575180B2 JPH0575180B2 JP1762186A JP1762186A JPH0575180B2 JP H0575180 B2 JPH0575180 B2 JP H0575180B2 JP 1762186 A JP1762186 A JP 1762186A JP 1762186 A JP1762186 A JP 1762186A JP H0575180 B2 JPH0575180 B2 JP H0575180B2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- electronic component
- anodic oxide
- oxide film
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 claims description 65
- 239000010407 anodic oxide Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000011282 treatment Methods 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000004040 coloring Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 230000005457 Black-body radiation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Sealing Battery Cases Or Jackets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1762186A JPS62174954A (ja) | 1986-01-28 | 1986-01-28 | 電子部品封止用キヤツプとその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1762186A JPS62174954A (ja) | 1986-01-28 | 1986-01-28 | 電子部品封止用キヤツプとその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62174954A JPS62174954A (ja) | 1987-07-31 |
| JPH0575180B2 true JPH0575180B2 (en]) | 1993-10-20 |
Family
ID=11948940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1762186A Granted JPS62174954A (ja) | 1986-01-28 | 1986-01-28 | 電子部品封止用キヤツプとその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62174954A (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2505868B2 (ja) * | 1988-10-15 | 1996-06-12 | 富士通株式会社 | 半導体装置 |
| US6010193A (en) * | 1997-07-14 | 2000-01-04 | Honda Giken Kogyo Kabushiki Kaisha | Anti-rattle guide assembly for supporting an armrest or other structure moveable between extended and retracted positions |
| JP4938535B2 (ja) * | 2007-04-13 | 2012-05-23 | カルソニックカンセイ株式会社 | コンソールボックス構造 |
| JP4914304B2 (ja) | 2007-07-30 | 2012-04-11 | ダイキョーニシカワ株式会社 | コンソールボックス |
-
1986
- 1986-01-28 JP JP1762186A patent/JPS62174954A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62174954A (ja) | 1987-07-31 |
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